The discharge device serves for fully automatic feeding of one or more packing machines.
Cut wafer rows are fed to the packing machines in single or double rows to the left or right or to the left and right.
The discharge device is characterised by an operating method which is very kind to the product: The wafer row to be discharged is separated cleanly from the following rows, then the actual discharge takes place. Up to 45 discharges per minute take place depending on the nature of the product, stack height and product dimensions.
